XZZ L2023 Smart Heating Platform for Stacked Boards

The XZZ (Xinzhizao) L2023 is a heating platform for separating double-layer phone motherboards, with modules sold for different iPhone generations.

The listing suggests about 180°C for iPhone X to 11 Pro Max and about 190°C for iPhone 12 to 15 models. The red host measures 150 x 135 x 20 mm and weighs 1.2 kg. Options are the host with an iPhone X to 14 Pro Max module, or separate modules for the iPhone 15, 16 and 17 series.

When you need a separation platform

• A dead iPhone with a fault between the board layers.

• Cracked interposer joints after a drop.

• Water damage that has reached the middle of the stack.

• A failed baseband or CPU area that needs both layers apart.

Using it safely

Put the host on a stable, heat-safe surface, let it reach temperature, then separate gently with suitable tools. Clean residue off the heating surface after use, and check the power cord for wear.

Start with the host plus the X to 14 Pro Max module, then add the 15, 16 or 17 modules as those phones come in.