MaAnt SL2 CPU Glue Removal Heating Platform

Underfill around a CPU is the toughest part of chip removal: too little heat and it won't budge, too much and the board warps. The MaAnt SL2 is a small heating platform made to soften that glue.

It measures 70 x 60 x 17 mm and weighs 65 g, in a 77 x 78 x 20 mm box. The listing describes even heating and adjustable temperature, but gives no temperature range, power rating or power source.

Chip work it supports

• A CPU that failed and needs lifting with its underfill.

• A memory chip with cracked joints after a drop.

• Corroded pads under a chip after liquid damage.

• Glue left on the board after a chip came off.

Working method

Warm slowly and check the glue with a probe before scraping. Use a plastic or fine blade to lift softened underfill, working inward from the edges. Protect nearby parts with heat tape.

At this size the SL2 sits in a small corner of the bench. Check the photos for how it's powered and controlled, as the listing doesn't explain.