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Apple · SKU IP91031 · Fits 1 model
$9.82
per unit| Quantity | Unit price | Saving |
|---|---|---|
| $9.82 | ||
| $9.33 | −5% | |
| $8.84 | −10% |
Selected SKU IP91031
Shipping weight 0.05 kg
Match the model number printed on the device (Settings → About, or on the back) before ordering.
A shorted rail on an iPhone 13 Pro Max can heat a section of the board until the layers delaminate. Once that happens, replacing the shorted part isn't enough. This CNC-machined donor board for the 13 Pro Max gives you a clean PCB to rebuild on.
It's sold as an upper layer without NAND, or a lower layer in a US or EU version, and it isn't a complete motherboard.
Delaminated or blistered board areas.
Burnt traces under a failed component.
Missing pads after heavy rework.
Liquid damage deep inside the board.
Assess how far the heat damage spread before deciding on a rebuild. Then move the components the repair needs, starting with the parts tied to the customer's data.
Use controlled heat and a preheater to avoid stressing the new PCB. Rejoin the halves, test the boot current on a bench supply and check charging, display and cameras before final assembly. Keep the damaged board until the customer has confirmed everything works, in case a missed component needs to be retrieved.
| Condition | New |
|---|---|
| Part type | CNC donor board (PCB) |
| Compatible devices | iPhone 13 Pro Max |
| Options | Upper layer (without NAND), lower layer US version, lower layer EU version |
No, it's a donor PCB.
The upper layer comes without NAND.
US and EU versions.

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