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iPhone 13 mini CNC Donor Board, Upper Layer (Without NAND)

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Part

iPhone 13 mini CNC Donor Board

Apple · SKU IP91022 · Fits 1 model

$7.34

per unit
Option
Volume pricing
QuantityUnit priceSaving
$7.34
$6.97−5%
$6.61−10%

Selected SKU IP91022

Shipping weight 0.05 kg

Compatible with 1 model

Match the model number printed on the device (Settings → About, or on the back) before ordering.

Details

Because the iPhone 13 mini's board is so small, a single burnt spot can take out several circuits at once. When the damage reaches the PCB layers, this CNC-machined donor board for the 13 mini gives you a base to rebuild on.

It's sold as an upper layer without NAND, or a lower layer in a US or EU version. It's a donor component, not a replacement motherboard.

Cases where it helps

  • A burnt spot affecting several circuits.

  • Broken traces under shield cans.

  • Board damage from a swollen battery.

  • Data recovery from a dead 13 mini.

Working small

Small boards leave little room for error. Use a stable holder, the finest nozzles you have and a microscope with good working distance. Protect neighboring parts with heat shielding as you move each chip.

Confirm the region version before starting, then rejoin the board and test it on a bench supply. Check that charging, display and cameras all work before final assembly. Leave the rebuilt phone running for a while on the bench, since joints on a board this small can fail once they warm up.

Specifications

ConditionNew
Part typeCNC donor board (PCB)
Compatible devicesiPhone 13 mini
OptionsUpper layer (without NAND), lower layer US version, lower layer EU version

Questions

Is the 13 mini board different from the 13?

Yes, each model has its own donor board listing.

Does it include NAND?

The upper layer is supplied without NAND.

Is it a full board?

No.

More parts for iPhone 13 mini

All iPhone 13 mini parts →

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