
Reballing Stencils & Platforms
Mijing MJ Z21 Max CPU Reballing Stencil with Magnetic Platform
$21.50
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2UUL · SKU 2U10128
$11.02
per unit| Quantity | Unit price | Saving |
|---|---|---|
| $11.02 | ||
| $10.47 | −5% | |
| $9.92 | −10% |
Shipping weight 0.3 kg
On stacked iPhone boards, the interposer (mid frame) has to be reballed before the two layers go back together, and it's thin enough to warp under hot air. The 2UUL BH11 is a universal holder for phone boards and mid frames during that work.
The listing describes adjustable clamps for different board shapes, a non-slip base, heat-resistant construction and alignment support for BGA reballing. It doesn't give dimensions or name compatible models.
A mid frame with missing solder balls after separation.
Lifted pads on an interposer that need careful repair.
A board that shifts under the stencil while you spread paste.
Cracked joints between board layers after a drop.
Clamp gently; too much pressure bends a thin mid frame. Work on a flat, stable surface with good ventilation, and wear safety glasses around hot solder.
The BH11 is the universal option. For iPhone 12 to 16 Pro Max boards, the 2UUL BH13 5-in-1 base adds model-specific stencils. Clean flux off the clamps between jobs.
| Brand | 2UUL |
|---|---|
| Model | BH11 |
| Condition | New |
| Product type | Universal board and mid frame reballing holder |
It's described as universal; no model list is given.
Yes, per the listing.
The listing doesn't mention any.

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