2UUL PB02 PadBall Solder Balls for Android Solder Pad Rework

Name: 2UUL PB02 PadBall Solder Balls for Android Solder Pad Rework
Brand: 2UUL
SKU: 2U10158
Price: 7.5 USD

2UUL · SKU 2U10158

$7.50

per unit

Volume pricing
Quantity	Unit price	Saving
	$7.50
	$7.13	−5%
	$6.75	−10%

Ships from Shenzhen, China. Check rates for your country
No sales tax added at checkout
Shipping & returns
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Shipping weight 0.05 kg

Details

Android boards vary more than Apple boards, but many of the pads under their CPU, modem and connectors are a similar size. When one of those pads tears loose, you need a small, uniform solder ball to rebuild the contact so the part can be reseated.

The 2UUL PB02 PadBall is the Android version of 2UUL's pad-repair solder balls. According to the listing, they're sized for the pad pitch on mainstream Android boards and are uniformly round. It also says they flow well when melted and give off little smoke. The listing doesn't give the diameter, alloy or count.

Jobs they suit

Pads that came away with a chip during removal.
Cracked or damaged pads under a connector.
Missing pads that stop a part from making contact.
Dense BGA areas where pads need rebuilding one by one.

Method

Power down and clean the area thoroughly. Set each ball on its pad, reflow it with controlled hot air, and stop heating once it forms a solid pad. Watch the temperature so nearby traces aren't damaged.

Close the pot after use and keep it away from moisture. Use the PB01 for iPhone boards.